MIL-STD-883G METHOD 2004.5 29 November 1985 1
1. PURPOSE. This method provides various tests for determining the integrity of microelectronic device leads (terminals), welds, and seals. Test condition A provides for straight tensile loading. Test condition B 1 provides for application of bending stresses to determine integrity of leads, seals, and lead plating while B 2 employs multiple application of bending stresses primarily to determine the resistance of the leads to metal fatigue under repeated bending. Test conditions C 1 and C 2 provide for application of torque or twisting stresses to device leads or studs, respectively, to determine integrity of leads and seals. Test condition D provides for application of peel and tensile stresses to determine integrity of terminal adhesion and plating of leadless packages. It is recommended that this test be followed by a seal test in accordance with method 1014 to determine any effect of the stresses applied on the seal as well as on the leads (terminals).
2. APPARATUS. See applicable test condition.
3. GENERAL PROCEDURE APPLICABLE TO ALL TEST CONDITIONS. The device shall be subjected to the stresses described in the specified test condition and the specified end-point measurements and inspections shall be made except for initial conditioning or unless otherwise specified. Unless otherwise specified, the Sample Size Series sampling shall apply to the leads, terminals, studs or pads chosen from a minimum of 3 devices.
4. SUMMARY. The following details and those required by the specific test condition shall be specified in the applicable acquisition document: a. Test condition letter. b. Number and selection of leads (terminals), if different from above. TEST CONDITION A - TENSION 1. PURPOSE. This test is designed to check the capabilities of the device leads, welds, and seals to withstand a straight pull. 2. APPARATUS. The tension test requires suitable clamps and fixtures for securing the device and attaching the specified weight without lead restriction. Equivalent linear pull test equipment may be used. 3. PROCEDURE. A tension of 0.227 kg (8 ounces), unless otherwise specified, shall be applied, without shock, to each lead or terminal to be tested in a direction parallel to the axis of the lead or terminal and maintained for 30 seconds minimum. The tension shall be applied as close to the end of the lead (terminal) as practicable. 3.1 Failure criteria. When examined using 10X magnification after removal of the stress, any evidence of breakage, loosening, or relative motion between the lead (terminal) and the device body shall be considered a failure. When a seal test in accordance with method 1014 is conducted as a post test measurement following the lead integrity test(s), meniscus cracks shall not be cause for rejection of devices which pass the seal test. 4. SUMMARY. The following details shall be specified in the applicable acquisition document: a. Weight to be attached to lead, if other than .227 kg (8 ounces) (see 3). b. Length of time weight is to be attached, if other than 30 seconds (see 3). TEST CONDITION B 1 - BENDING STRESS 1. PURPOSE. This test is designed to check the capability of the leads, lead finish, lead welds, and seals of the devices to withstand stresses to the leads and seals which might reasonably be expected to occur from actual handling and assembly of the devices in application, or to precondition the leads with a moderate bending stress prior to environmental testing. 2. APPARATUS. Attaching devices, clamps, supports, or other suitable hardware necessary to apply the bending stress through the specified bend angle.